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author | Jake Weinstein <jake@aospa.co> | 2023-05-16 05:18:11 +0900 |
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committer | Jake Weinstein <jake@aospa.co> | 2023-05-16 05:19:22 +0900 |
commit | 8aa714fcc6b7537ffda3bcb03cdc9963f71acbfe (patch) | |
tree | 66fb061d8474e8c808a75edd133c949c5ee62710 /thermalCommon.cpp | |
parent | 5927083a62500a83e15361826bea1dbe68cc91b8 (diff) |
Revert "thermal-hal: Add thermal HAL 2.0 support for monaco"HEADuminekotachibana-mr1
Qualcomm picked "thermal-hal: Add support for hal specific configuration."
39ff74035adc9fe28715e7000e7fe48e8e2b5fe4 to LA.VENDOR.13.2.0,
which duplicates these functions. Stick with the new upstream
rather than old upstream. Monaco is a wearable chip, which
we do not expect to support anyway.
This reverts commit ffd812bff5dab55dad2cc4833f4c069fa67e005c.
Change-Id: I9db8df14305819fbdaf755ace8ae7f2cf752e1ab
Diffstat (limited to 'thermalCommon.cpp')
0 files changed, 0 insertions, 0 deletions